CLIENT ST Microelectronics, Inc., CLIENT Datasheet - Page 56

• Manufacturer Part Number: CLIENT
• Description: STPC Client Datasheet / PC Compatible Embeded Microprocessor
• Manufacturer: ST Microelectronics, Inc.

BOARD LAYOUT
A local ground plane on opposite side of the board
as shown in
tion. It is used to connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
56/61
Figure 6-6. Bottom side layout and decoupling
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes
Figure 6-6
improves thermal dissipa-
Issue 2.2 - October 13, 2000
Die
This possibility of using the whole system’s box for
thermal dissipation is very usefull in case of high
temperature inside the system and low tempera-
ture outside. In that case, both sides of the PBGA
should be thermally connected to the metal chas-
sis in order to propagate the heat through the met-
al.
Figure 6-7
Via to ground layer
Ground plane for thermal dissipation
illustrates such an implementation.
Thermal conductor
Board