RMPA1956-103 Raytheon RF Components, RMPA1956-103 Datasheet - Page 14

• Manufacturer Part Number: RMPA1956-103
• Description: Type = Amps, Cdma & CDMA2000-1X ;; Circuit Description = 3.5 V Dual Band Tri-mode Amps, Cdma &CDMA2000-1X Power Amplifier Module ;; Frequency = 824-1910 MHZ
• Manufacturer: Raytheon RF Components

RF Components
Application Information
www.raytheonrf.com
Specifications are based on most current or latest revision.
Revised February 6, 2003
RMPA1956-103 - 3.5 V Dual Band Tri-Mode
AMPS, CDMA & CDMA2000-1X Power Amplifier
Module
Precautions to Avoid Permanent Device Damage:
Device Usage: Raytheon recommends the following procedures prior to assembly.
Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT
attachment. Hand soldering is not recommended.
Cleanliness: Observe proper handling procedures to ensure clean devices and
Device Cleaning: Standard board cleaning techniques should not present device
Static Sensitivity: Follow ESD precautions to protect against ESD damage:
General Handling: Handle the package on the top with a vacuum collet or along the
Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this
Dry-bake devices at 125 C for 24 hours minimum. Note: The shipping trays cannot
Assemble the dry-baked devices within 7 days of removal from the oven.
During the 7-day period, the devices must be stored in an environment of less
If the 7-day period or the environmental conditions have been exceeded, then the
Reflow Profile
PCBs. Devices should remain in their original packaging until component
placement to ensure no contamination or damage to RF, DC & ground contact
areas.
problems provided that the boards are properly dried to remove solvents or
water residues.
edges with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, &
ground contacts on the package bottom. Do not apply excessive pressure to
the top of the lid.
condition, devices are protected and require no special storage conditions.
Once the sealed bag has been opened, devices should be stored in a dry
nitrogen environment.
withstand 125 C baking temperature.
than 60% relative humidity and a maximum temperature of 30 C
dry-bake procedure must be repeated.
A properly grounded static-dissipative surface on which to place devices.
Static-dissipative floor or mat.
A properly grounded conductive wrist strap for each person to wear while
Ramp-up: During this stage the solvents are evaporated from the solder
Pre-heat/soak: The soak temperature stage serves two purposes; the flux is
handling devices.
paste. Care should be taken to prevent rapid oxidation (or paste slump)
and solder bursts caused by violent solvent out-gassing. A typical heating
rate is 1- 2°C/sec.
activated and the board and devices achieve a uniform temperature. The
recommended soak condition is: 120-150 seconds at 150°C.
Page 14
PRODUCT INFORMATION
Raytheon RF Components
Andover, MA 01810
362 Lowell Street