RMPA1956-103 Raytheon RF Components, RMPA1956-103 Datasheet - Page 15

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RMPA1956-103

Manufacturer Part Number
RMPA1956-103
Description
Type = Amps, Cdma & CDMA2000-1X ;; Circuit Description = 3.5 V Dual Band Tri-mode Amps, Cdma &CDMA2000-1X Power Amplifier Module ;; Frequency = 824-1910 MHZ
Manufacturer
Raytheon RF Components
Datasheet
RF Components
Application Information
(Cont)
Recommended Solder
Reflow Profile
www.raytheonrf.com
Specifications are based on most current or latest revision.
Revised February 6, 2003
Reflow Zone: If the temperature is too high, then devices may be damaged by
Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock.
Solder Joint Characteristics: Proper operation of this device depends on a reliable void-
Rework Considerations: Rework of a device attached to a board is limited to reflow of the
RMPA1956-103 - 3.5 V Dual Band Tri-Mode
AMPS, CDMA & CDMA2000-1X Power Amplifier
Module
mechanical stress due to thermal mismatch or there may be problems due to
excessive solder oxidation. Excessive time at temperature can enhance the formation
of inter-metallic compounds at the lead/board interface and may lead to early
mechanical failure of the joint. Reflow must occur prior to the flux being completely
driven off. The duration of peak reflow temperature should not exceed 10 seconds.
Maximum soldering temperatures should be in the range 215-220°C, with a maximum
limit of 225°C.
However, rapid cooling promotes a finer grain structure and a more crack-resistant
solder joint. The illustration below indicates the recommended soldering profile.
free attachment of the heatsink to the PWB. The solder joint should be 95% void-free
and be a consistent thickness.
solder with a heat gun. The device should not be subjected to more than 225°C and
reflow solder in the molten state for more than 5 seconds. No more than 2 rework
operations should be performed.
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PRODUCT INFORMATION
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Raytheon RF Components
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Andover, MA 01810
362 Lowell Street
30 0

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