MT28F128J3FS-15F Micron, MT28F128J3FS-15F Datasheet - Page 50

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MT28F128J3FS-15F

Manufacturer Part Number
MT28F128J3FS-15F
Description
128Mb Q-FLASH MEMORY
Manufacturer
Micron
Datasheet
NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATIONS
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full
128Mb, 64Mb, 32Mb Q-Flash Memory
MT28F640J3_6.p65 – Rev. 5, Pub. 6/02
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
SEATING PLANE
Micron and the M logo are registered trademarks, and the Micron logo and Q-Flash are trademarks of Micron Technology, Inc.
64X
7.00 ±0.05
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
0.45
0.08 C
3.50 ±0.05
characterization of production devices.
BALL A8
0.850 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
3.50 ±0.05
1.00 TYP
10.00 ±0.10
7.00
C L
5.50 ±0.05
64-BALL FBGA
1.00 TYP
C L
6.50 ±0.05
BALL A1
BALL A1 ID
50
13.00 ±0.10
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .33mm
128Mb, 64Mb, 32Mb
Q-FLASH MEMORY
BALL A1 ID
PRELIMINARY
©2002, Micron Technology, Inc.

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