PBSS4480X Philips Semiconductors, PBSS4480X Datasheet - Page 5
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PBSS4480X
Manufacturer Part Number
PBSS4480X
Description
80 V/ 4 A NPN low VCEsat (BISS) transistor
Manufacturer
Philips Semiconductors
Datasheet
1.PBSS4480X.pdf
(13 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PBSS4480X
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
Company:
Part Number:
PBSS4480X/DG
Manufacturer:
NXP
Quantity:
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Company:
Part Number:
PBSS4480X135
Manufacturer:
NXP Semiconductors
Quantity:
135
Philips Semiconductors
THERMAL CHARACTERISTICS
Notes
1. Operated under pulsed conditions; pulse width t
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm
4. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm
5. Device mounted on a 7 cm
2004 Oct 25
R
R
th(j-a)
th(j-s)
80 V, 4 A
NPN low V
Mounted on FR4 printed-circuit board; standard footprint.
(1)
(2)
SYMBOL
mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook” .
(K/W)
Z
10
th
10
10
10
= 1.
= 0.75.
1
3
2
1
10
5
thermal resistance from junction
to ambient
thermal resistance from junction
to soldering point
CEsat
(3)
(4)
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
10
(10)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
4
= 0.5.
= 0.33.
(BISS) transistor
PARAMETER
2
ceramic printed-circuit board, 1 cm
10
(5)
(6)
3
= 0.2.
= 0.1.
10
2
in free air
p
(7)
(8)
notes 1 and 2
note 2
note 3
note 4
note 5
10 ms; duty cycle
= 0.05.
= 0.02.
10
5
1
CONDITIONS
2
(9)
(10) = 0.
single-sided copper and tin-plated. For other
1
= 0.01.
0.2.
10
VALUE
225
125
10
50
90
80
16
2
PBSS4480X
Product specification
t
p
006aaa232
(s)
10
UNIT
3
K/W
K/W
K/W
K/W
K/W
K/W
2
2
.
.