upd70208h Renesas Electronics Corporation., upd70208h Datasheet - Page 103

• Manufacturer Part Number: upd70208h
• Description: V40hltm, V50hltm 16/8, 16-bit Microprocessor
• Manufacturer: Renesas Electronics Corporation.

18. RECOMMENDED SOLDERING CONDITIONS
Semiconductor Device Mounting Technology Manual (C10535E).
(1)
Infrared reflow
VPS
Wave soldering
Partial pin heating
Infrared reflow
VPS
Wave soldering
Partial pin heating
Soldering Method
Soldering Method
This product should be soldered and mounted under the conditions recommended in the table below.
For the details of recommended soldering conditions for the surface mounting type, refer to the information document
For soldering methods and conditions other than those recommended below, contact our salesman.
(a) K, E, X masks
(b) P, M masks
PD70208HGF- -3B9 : 80-pin plastic QFP (14
PD70216HGF- -3B9 : 80-pin plastic QFP (14
Note
This means the number of days after unpacking the dry pack. Storage conditions are 25 C and 65% RH
max.
Package peak temperature : 230 C, Time: 30 sec. max. (210 C min.),
Number of times: 1, Number of days
at 125 C for 10 hours)
Package peak temperature: 215 C, Time: 40 sec. max. (200 C min.),
Number of times: 1, Number of days
at 125 C for 10 hours)
Solder bath temperature: 260 C max. Time: 10 sec. max., Number of times: 1,
Preheating temperature: 120 C max. (Package surface temperature), Number of
days
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Package peak temperature: 235 C, Time: 30 sec. max. (210 C min.),
Number of times: 2 max., Number of days
necessary at 125 C for 20 hours).
Package peak temperature: 215 C, Time: 40 sec. (200 C min.)
Number of times: 2 max., Number of days
necessary at 125 C for 20 hours).
Solder bath temperature: 260 C max., Time: 10 sec. max.,
Number of times: 1, Preheating temperature: 120 C max. (Package surface
temperature). Number of days
125 C for 20 hours).
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Note
: 7 days (after this, prebaking is necessary at 125 C for 10 hours).
Table 18-1. Soldering Conditions
Data Sheet U13225EJ4V0DS00
Soldering Conditions
Soldering Conditions
Note
: 7 days (after this, prebaking is necessary at
Note
Note
20 mm)
20 mm)
: 7 days (after this, prebaking is necessary
: 7 days (after this, prebaking is necessary
Note
Note
: 7 days (after this, prebaking is
: 7 days (after this prebaking is
PD70208H, 70216H
Conditions Symbol
Conditions Symbol
Recommended
Recommended
WS60-107-1
WS60-207-1
VP15-107-1
VP15-207-2
IR30-107-1
IR35-207-2
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