bsv-1.5s12r0h XP Power Limited, bsv-1.5s12r0h Datasheet - Page 27

• Manufacturer Part Number: bsv-1.5s12r0h
• Description: Pol Dc-dc Converter
• Manufacturer: XP Power Limited

<Thermal Derating>
Set this product in a place where good convection is ensured. And also be sure to mount on a board, when using.
This product has been designed to radiate by utilizing the mounted board. So make the line to connect to the converter as wide as possible.
The radiation from GND is especially big, so make the GND line wide.
The derating curve below is a data when mounted on a double-side board of copper foil thickness 70µm, copper foil area 100×100mm (both sides)
and thickness of the board 1.6mm. The radiation charateristics will change depending on the wiring, so please refer to the data.
The thermal characteristics for this converter will be largely influenced by the mounted board and the ambient condition. For this reason, finally mount
the converter into the device that will be actually mounted. And when it is operated at the maxmimun ambient temperature of the equipment, be sure
that the temperature of the board surface does not exceed 100°C.
<Cleaning Conditions>
This product can not be washed whole. No-clean solder paste is recommended for this product.
<Soldering Conditions>
- Soldering Conditions
- About storage before being mounted
Bellnix DC-DC CONVERTERS
Storage conditions before being mounted should be 30°C/ 60% RH or below.
Solder under the following conditions.
Pre-heating temp.: 150-180°C, within 1min.
Peak heating temp.: 250°C max.
Reflow: twice
Note 1. Do not give shock at reflow.
Note 2. This converter can not be mounted by flow.
Note 3. This converter can not be reflowed with the component side
12
10
4
8
6
2
0
-40 -30
faced down.
Vin=5.0V
Vout=3.3V
220°C or more, within 1min.
-20 -10
0
Ambient Temperature (°C)
10
High-Speed Response, Step-Down DC-DC Converter
20
Elemental converter
0.5m/s
1.0m/s
2.0m/s
0m/s
30
0m/s
40
50
60
70
2.3℃/sec. max.
80
Temp. regulation point is the
component surface temp.
- Copper foil thickness 70µm
- Copper foil area
- Board thickness
Pattern Conditions for heat radiaton
180℃
150℃
60sec. max.
Ultra High Efficiency 93%
2℃/sec. max.
100×100mm(both sides)
1.6mm
BDD20080825
BSV-H Series
60sec. max.
Peak:250℃ max.
220℃
1 to 4℃/sec.
Time
5