bsv-1.5s12r0h XP Power Limited, bsv-1.5s12r0h Datasheet - Page 44

• Manufacturer Part Number: bsv-1.5s12r0h
• Description: Pol Dc-dc Converter
• Manufacturer: XP Power Limited

6. Temperature Derating
Place the product where there is good air flow. Since the product was made to radiate heat using PCB,
make sure to place the product onto the PCB. Patterns to converters should be taken thick and wide,
especially lines to GND pin. Since it has a larger heat release, the line needs to be wide enough.
The derating curve below is when BSV-1.8S4R0N is mounted onto the evaluation board
(BSV-1.8S4R0NEVM-01: Double-sided board of Copper coating thickness 35µm, Copper coating
dimension 80 x 75mm, PCB thickness 1.6mm). The heat release characteristics may change
depending on wiring.
The temp characteristics are largely affected by PCB and the ambient temp. Therefore, make sure that
IC surface temp of the converter does not exceed 120°C when operated at the max ambient temp while
mounted onto an actual device.
DC-DC Converter
5
4
3
2
1
0
5
4
3
2
1
0
-40
-40
Derating curve when BSV-1.8S4R0N is mounted on an evaluation board
Small Type High-Speed Response POL DC-DC Converter
Vin=5V
0m/s
Vin=5V
Vout=1.8V
-30
-30
-20
-20
-10
-10
0
0
10
10
20
20
30
30
40
40
Vout=0.8V
Vout=1.2V
Vout=1.8V
50
50
2m/s
1m/s
0m/s
60
60
70
70
80
80
BSV-nano Series
90
90
100
100
BDD20100416
5