ad80164absvz Analog Devices, Inc., ad80164absvz Datasheet - Page 66

• Manufacturer Part Number: ad80164absvz
• Description: Dual, 12-/14-/16-bit,1 Gsps Digital-to-analog Converters
• Manufacturer: Analog Devices, Inc.

AD9776A/AD9778A/AD9779A
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9776ABSVZ
AD9776ABSVZRL
AD9778ABSVZ
AD9778ABSVZRL
AD9779ABSVZ
AD9779ABSVZRL
AD9776A-EBZ
AD9778A-EBZ
AD9779A-EBZ
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
PLANE
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
25
Figure 120. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
1
100
26
0.50 BSC
16.00 BSC SQ
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
(PINS DOWN)
TOP VIEW
14.00 BSC SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. 0 | Page 66 of 68
(SV-100-1)
0.15
0.05
50
76
75
51
Package Description
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
Evaluation Board
Evaluation Board
Evaluation Board
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
100
26
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
1
25