lmk03000c National Semiconductor Corporation, lmk03000c Datasheet - Page 23

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lmk03000c

Manufacturer Part Number
lmk03000c
Description
Precision Clock Conditioner With Integrated Vco
Manufacturer
National Semiconductor Corporation
Datasheet
20211473
FIGURE 3. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground plane layer is not
exposed). This is done by including a copper area of about 2 square inches on the opposite side of the PCB from the device. This
copper area may be plated or solder coated to prevent corrosion but should not have conformal coating (if possible), which could
provide thermal insulation. The vias shown in Figure 3 should connect these top and bottom copper layers and to the ground layer.
These vias act as “heat pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
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