pcf2123 NXP Semiconductors, pcf2123 Datasheet - Page 44

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pcf2123

Manufacturer Part Number
pcf2123
Description
Spi Real Time Clock/calendar
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
14. Package outline
Fig 29. Package outline of PCF2123TS (SOT402-1)
PCF2123_1
Product data sheet
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT402-1
max.
1.1
A
0.15
0.05
A
1
0.95
0.80
14
A
1
2
y
IEC
Z
0.25
pin 1 index
A
e
3
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
8
7
REFERENCES
Rev. 01 — 19 November 2008
D
5.1
4.9
0
(1)
w
M
E
4.5
4.3
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
SPI Real time clock/calendar
0.2
v
Q
A
(A )
0.13
3
w
X
v
PCF2123
0.1
A
© NXP B.V. 2008. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.72
0.38
Z
(1)
SOT402-1
8
0
o
o
44 of 54

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