pcf2123 NXP Semiconductors, pcf2123 Datasheet - Page 45

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pcf2123

Manufacturer Part Number
pcf2123
Description
Spi Real Time Clock/calendar
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
Fig 30. Package outline of PCF2123BS (SOT758-1)
PCF2123_1
Product data sheet
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT758-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
b
4
1
IEC
- - -
0.2
c
16
5
D
3.1
2.9
(1)
e
0
1.75
1.45
D h
D h
e 1
D
MO-220
JEDEC
1/2
E
3.1
2.9
e
(1)
REFERENCES
Rev. 01 — 19 November 2008
b
13
8
1.75
1.45
E h
9
12
w
v
0.5
e
B
M
M
JEITA
scale
e
- - -
2.5
C
C
A
E
1/2
1.5
e 1
A
e
B
e 2
1.5
e 2
0.5
0.3
L
0.1
v
A
y 1 C
A 1
5 mm
0.05
w
PROJECTION
EUROPEAN
SPI Real time clock/calendar
0.05
y
detail X
0.1
y 1
X
C
PCF2123
© NXP B.V. 2008. All rights reserved.
y
ISSUE DATE
02-03-25
02-10-21
SOT758-1
c
45 of 54

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