pca9665 NXP Semiconductors, pca9665 Datasheet - Page 84

• Manufacturer Part Number: pca9665
• Description: Fm+ Parallel Bus To I2c-bus Controller
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PCA9665_2
Product data sheet
Table 54.
Table 55.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 49. Temperature profiles for large and small components
2.5
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 54
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
55
Rev. 02 — 7 December 2006
49.
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
Fm+ parallel bus to I
220
220
350
temperature
peak
> 2000
260
245
245
PCA9665
© NXP B.V. 2006. All rights reserved.
2
C-bus controller
001aac844
time
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