mpc8313e Freescale Semiconductor, Inc, mpc8313e Datasheet - Page 76

• Manufacturer Part Number: mpc8313e
• Description: Mpc8313e Powerquicc Ii Pro Processor
• Manufacturer: Freescale Semiconductor, Inc

Thermal
20 Thermal
This section describes the thermal specifications of the MPC8313E.
20.1
Table 62
76
Junction to Ambient Natural
Convection
Junction to Ambient Natural
Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
6. Thermal characterization parameter indicating the temperature difference between package top and the
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on
the board, and board thermal resistance.
is measured on the top surface of the board near the package.
SPEC-883 Method 1012.1).
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JT.
provides the package thermal characteristics for the 516 27 × 27 mm TEPBGAII.
Thermal Characteristics
Characteristic
MPC8313E PowerQUICC
Table 62. Package Thermal Characteristics for TEPBGAII
™
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
II Pro Processor Hardware Specifications, Rev. 0
Natural Convection
Board type
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
TEPBGAII
25
18
20
15
10
8
7
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1,2,3
1,2
1,3
1,3
4
5
6