lpc4310 NXP Semiconductors, lpc4310 Datasheet - Page 50
lpc4310
Manufacturer Part Number
lpc4310
Description
Lpc4350/30/20/10 32-bit Arm Cortex-m4/m0 Mcu; Up To 264 Kb Sram; Ethernet; Two High-speed Usbs; Advanced Configurable Peripherals
Manufacturer
NXP Semiconductors
Datasheet
1.LPC4310.pdf
(85 pages)
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9. Thermal characteristics
Table 5.
V
LPC4350_30_20_10
Objective data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 1 — 29 October 2010
–
)
)
j
(°C), can be calculated using the following
32-bit ARM Cortex-M4/M0 microcontroller
Min
-
DD
and V
LPC4350/30/20/10
DD
Typ
-
. The I/O power dissipation of
Max
<tbd>
© NXP B.V. 2010. All rights reserved.
Unit
°C
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