tle8261-2e Infineon Technologies Corporation, tle8261-2e Datasheet - Page 18

• Manufacturer Part Number: tle8261-2e
• Description: Universal System Basis Chip Hermes
• Manufacturer: Infineon Technologies Corporation

5.3
Pos.
5.3.1
5.3.2
Thermal Prewarning and Shutdown Junction Temperatures;
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
5.3.8
5.3.9
1) Specified Rthja value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 single layer. The product (chip +
2) According to Jedec JESD51-2,-5,-7 at natural convection on 2s2p board for 2W. Board: 76.2x114.3x1.5mm³ with 2 inner
3) Not subject to production test; specified by design;
Data Sheet
package) was simulated on a 76.4 x 114.3 x 1.5 mm board.
copper layers (35µm thick)., with thermal via array under the exposed pad contacted the first inner copper layer and
600mm2 cooling are on the top layer (70µm)
Parameter
Junction Ambient
Junction Ambient
Junction to Soldering Point
V
ON Temperature
V
Hysteresis
V
Temperature
V
Hysteresis
V
Temperature
CAN Transmitter Thermal
Shutdown Temperature
CAN Transmitter Thermal
Shutdown Hysteresis
CC1µC
CC1µC
CC1µC
CC1µC
CC1µC,
Thermal Characteristics
,
, Ratio of SD to PW
, Thermal Pre-warning
, Thermal Prewarning
V
V
CC2
CC2
Thermal Shutdown
Thermal Shutdown
Symbol
R
R
R
T
∆
T
∆
T
T
T
∆
jPW
T
jSDVcc
T
jSDVcc/
jPW
jSDCAN
T
thJA_1L
thJA_4L
thJSP
PW
SDVcc
CAN
18
Min.
–
–
–
120
–
150
–
–
150
–
Limit Values
Typ.
40
25
5
145
25
185
35
1.20
–
10
Max.
–
170
–
200
–
–
200
–
General Product Characteristics
Unit
K/W
K/W
K/W
°C
K
°C
K
–
°C
K
Rev. 1.0, 2009-05-26
Test Conditions
1) 3)
cooling area
2) 3)
cooling area
3)
-
3)
3)
3)
3)
3)
3)
3)
2s2p + 600 mm
300 mm
TLE8261-2E
2
2