tle8261-2e Infineon Technologies Corporation, tle8261-2e Datasheet - Page 9

• Manufacturer Part Number: tle8261-2e
• Description: Universal System Basis Chip Hermes
• Manufacturer: Infineon Technologies Corporation

Pin
27
28
29
30
31
32
33
34
35
36
EDP
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
Data Sheet
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Symbol
n.c.
n.c.
n.c.
n.c.
GND
n.c.
LH_SI
WK
Limp Home
LH_PL/Test
-
Function
Not connected
Not connected
Not connected
Not connected
Ground
Not connected
Limp Home side indicator; Side indicators 1.25Hz 50% duty cycle output; Open
drain. Active LOW.
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
Fail-Safe Function Output; Open drain. Active LOW.
SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-
up resistor. Connect to
Limp Home Pulsed Light output: Brake/rear light 100Hz 20% duty cycle output;
Open drain. Active LOW.
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.
V
S
9
or leave open for normal operation.
Rev. 1.0, 2009-05-26
Pin Configuration
TLE8261-2E
1)