isd-t360sb ETC-unknow, isd-t360sb Datasheet - Page 14
![no-image](/images/no-image-200.jpg)
isd-t360sb
Manufacturer Part Number
isd-t360sb
Description
Manufacturer
ETC-unknow
Datasheet
1.ISD-T360SB.pdf
(112 pages)
- Current page: 14 of 112
- Download datasheet (2Mb)
ISD-T360SB
For optimal noise immunity, the power and
ground pins should be connected to V
ground planes, respectively, on the printed circuit
board. If V
single conductors should be run directly from
each V
GND pin to a ground point. Avoid daisy-chained
connections. The VoiceDSP does not perform its
usual functions in power-down mode but it still pre-
serves stored messages, maintains the time of
day.
When you build a prototype, using wire-wrap or
other methods, solder the capacitors directly to
the power pins of the VoiceDSP processor socket,
or as close as possible, with very short leads.
1-6
CC
CC
pin to a power point, and from each
and the ground planes are not used,
C
13
+
C
Figure 1-6: 5 V Power Connection Diagram
7
5 V Supply
C
14
+
V
V
V
CC
CC
SS
CCHI
and the
V
17
19
20
SS
97
V
CC
V
C
C
40
CC
9
5
95
ISD-T360
+
V
CC
+
87
1.2.5
Flash Support
The ISD-T360SB VoiceDSP supports Flash devices
for storing recorded data, thus, power can be dis-
connected to the ISD-T360SB without losing data.
The ISD-T360SB supports NAND Flash device inter-
faces,
TC58A040F, KM29N040T, KM29W8000T/IT, and
KM29W16000AT/AIT. The ISD-T360SB may be con-
nected to up to four Flash devices, resulting with
maximum recording storage of 16-Mbits x 4 =
64 Mbits (up to 4 hours of recording time).
The following flash devices are supported:
C
V
C
+
R
CCA
3
12
1
86
V
SS
42
V
C
C
SS
76
66
64
84
10
6
MEMORY INTERFACE
such
V
V
V
SSA
SS
CC
C
1
as
C
4
+
+
TC58V16BFT,
C
C
8
11
Voice Solutions in Silicon
1—HARDWARE
TC5816BFT,
™
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