isd-t360sb ETC-unknow, isd-t360sb Datasheet - Page 44

• Manufacturer Part Number: isd-t360sb
• Manufacturer: ETC-unknow

ISD-T360SB
2.2.2
DEVICE NUMBER AND TYPE
The VoiceDSP processor supports various types of
Flash memory devices. Up to four devices may be
connected to the VoiceDSP, where all the con-
nected devices must be of the same type. Each
memory device may be of 4Mbit, 8Mbit or
16Mbit; thus a total of 64Mbit non-volatile memo-
ry may be connected for message storage (up to
4 hours of voice recording).
See “MEMORY INTERFACE” on page 1-6, for de-
tailed description of the supported Flash and the
hardware connectivity.
Use the CFG command to define the type and
number of installed memory devices (see “CFG
Configure VoiceDSP config_value” on page 2-26).
MEMORY DEVICE SIZE
The memory manager handles the memory de-
vices in basic units of 4Kbyts blocks. This approach
is defined due to the nature of Flash devices
where the basic unit that can be erased is a
4Kbytes block.
Memory blocks cannot be shared by different
voice messages. Therefore, the maximum num-
ber of messages per memory device, equals to
the number of memory blocks minus one (one
block per device is used for memory manage-
ment).
The size of the connected memory devices, is de-
fined by the number of memory blocks in each
device. Refer to tunable parameter index 62, in
Table 2-10, for detailed description of the avail-
able number of blocks for Flash.
PRODUCTION LINE TESTING
In many cases it is desired to test the ISD-T360SB in
the production line as part of the whole applica-
tion. Usually in these cases, the testing time is an
important factor and should be minimized as pos-
sible. The initialization time of the memory devices
2-8
MEMORY INTERFACE
is significant and should be avoided during pro-
duction (Refer to Table 1-4). Therefore, a dedicat-
ed parameter is defined in order to allow a
production line testing while using a small part of
the real connected memory size.
It should be noted that in case of power failure
during the production line testing, the connected
memory devices should be replaced, and the
process should be repeated. Refer to parameter
index 63, in Table 2-10, for further explanation of
the production line testing.
Voice Solutions in Silicon
2—SOFTWARE
™