w25q80bv Winbond Electronics Corp America, w25q80bv Datasheet - Page 68
w25q80bv
Manufacturer Part Number
w25q80bv
Description
8m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet
1.W25Q80BV.pdf
(72 pages)
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8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
SOLDER PATTERN
package.
placement of exposed PCB vias under the pad.
SYMBOL
M
N
Q
R
P
MIN
MILLIMETERS
T
3.40
4.30
6.00
0.50
0.75
YP.
MAX
- 68 -
MIN
INCHES
0.13 8
0.16 2
0.23 0
0.01 6
0.02 5
TYP.
3
9
6
9
5
MAX
W25Q80BV