cy62127dv30ll-70zsi Cypress Semiconductor Corporation., cy62127dv30ll-70zsi Datasheet - Page 2
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cy62127dv30ll-70zsi
Manufacturer Part Number
cy62127dv30ll-70zsi
Description
1 Mb 64k X 16 Static Ram
Manufacturer
Cypress Semiconductor Corporation.
Datasheet
1.CY62127DV30LL-70ZSI.pdf
(12 pages)
Document #: 38-05229 Rev. *D
Pin Configuration
Product Portfolio
Notes:
2. NC pins are not connected to the die.
3. E3 (DNU) can be left as NC or Vss to ensure proper operation. (Expansion Pins on FBGA Package: E4 - 2M, D3 - 4M, H1 - 8M, G2 - 16M, H6 - 32M).
4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CY62127DV30LL
CY62127DV30LL
CY62127DV30LL
CY62127DV30L
CY62127DV30L
CY62127DV30L
Product
I/O
BLE
V
V
I/O
I/O
I/O
NC
SS
CC
1
14
15
8
9
BHE
I/O
I/O
I/O
I/O
OE
NC
A
2
8
10
11
12
13
FBGA (Top View)
DNU
A
NC
A
A
A
A
A
3
14
12
5
9
0
3
[2, 3]
Min.
2.2
2.2
2.2
A
A
A
A
A
A
NC
A
4
15
10
13
1
4
7
V
6
CC
CE
I/O
I/O
I/O
I/O
WE
A
Range (V)
A
Typ.
5
11
2
3.0
3.0
3.0
1
3
4
5
NC
V
V
NC
I/O
I/O
I/O
I/O
SS
6
CC
0
2
6
7
Max.
3.6
3.6
3.6
D
G
B
C
E
F
H
A
Speed
(ns)
45
45
55
55
70
70
Typ
0.85
0.85
0.85
0.85
0.85
0.85
f = 1 MHz
[4]
Operating, I
Max.
I/O
I/O
I/O
I/O
V
I/O
I/O
I/O
I/O
1.5
1.5
1.5
1.5
1.5
1.5
V
WE
A
A
A
A
NC
CE
CC
A
A
A
A
A
SS
15
14
13
12
TSOP II (Forward)
4
3
2
1
0
0
1
2
3
4
5
6
7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Top View
Power Dissipation
CC
Typ.
6.5
6.5
5
5
5
5
(mA)
f = f
[4]
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
CC
= V
MAX
A
A
A
OE
BHE
BLE
I/O
I/O
I/O
I/O
V
V
I/O
I/O
I/O
I/O
NC
A
A
A
A
NC
5
6
7
SS
CC
8
9
10
11
CC(typ)
Max.
15
14
13
12
11
10
9
8
13
13
10
10
10
10
, T
CY62127DV30
A
= 25C.
Standby, I
Typ.
1.5
1.5
1.5
1.5
1.5
1.5
[4]
MoBL
Page 2 of 12
SB2
Max.
5
4
5
4
5
4
(µA)
®