m58lt256jsb STMicroelectronics, m58lt256jsb Datasheet - Page 70

• Manufacturer Part Number: m58lt256jsb
• Description: 256 Mbit 16 Mb 16, Multiple Bank, Multilevel, Burst 1.8 V Supply, Secure Flash Memories
• Manufacturer: STMicroelectronics

Package mechanical
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Package mechanical
To meet environmental requirements, ST offers these devices in ECOPACK® packages,
which have a lead-free second-level interconnect. The category of second-level interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 18. TBGA64 10 × 13 mm - 8 x 8 active ball array, 1 mm pitch, bottom view
1. Drawing is not to scale.
E
package outline
BALL "A1"
FD
E1
FE
A
e
D1
D
SD
b
A1
SE
A2
M58LT256JST, M58LT256JSB
BGA-Z23
ddd