se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 32
se97pw/1
Manufacturer Part Number
se97pw/1
Description
Se97 Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet
1.SE97PW1.pdf
(43 pages)
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NXP Semiconductors
SE97_2
Product data sheet
Fig 23. Average supply current
Fig 25. Average supply current during EEPROM write
Fig 27. EVENT output current
I
I
DD(AV)
DD(AV)
(mA)
( A)
( A)
I
OL
500
400
300
200
100
600
500
400
300
200
8.0
6.0
4.0
2.0
0
0
I
Temp sensor and EEPROM active.
V
2
40
40
50
C-bus and EEPROM inactive.
OL
= 0.4 V.
25
0
0
0
V
V
25
DD
DD
40
40
V
V
= 3.0 V to 3.6 V
= 1.7 V
DD
DD
50
= 3.6 V
= 3.6 V
3.0 V
3.0 V
75
80
80
T
T
T
amb
amb
amb
002aad258
002aac910
002aac912
100
( C)
( C)
( C)
Rev. 02 — 12 October 2007
120
120
125
Fig 24. Shutdown supply current
Fig 26. Typical temperature accuracy
Fig 28. SDA output current
I
Memory module temp sensor with integrated SPD
OL(sink)(SDA)
I
T
sd(VDD)
lim(acc)
( A)
( C)
(mA)
3.0
1.0
1.0
3.0
25
20
15
10
5
3
1
1
0
5
0
I
V
V
2
40
40
40
C-bus, temp sensor and EEPROM inactive.
DD
OL
V
= 0.6 V.
= 3.0 V to 3.6 V.
DD
= 3.6 V
3.0 V
0
0
0
40
40
40
V
DD
80
80
80
© NXP B.V. 2007. All rights reserved.
= 3.6 V
T
T
T
amb
amb
amb
002aac911
002aac913
002aac907
3.0 V
( C)
( C)
( C)
120
120
120
SE97
32 of 43
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