lpc1114fn28/102 NXP Semiconductors, lpc1114fn28/102 Datasheet - Page 3

• Manufacturer Part Number: lpc1114fn28/102
• Description: 32-bit Arm Cortex-m0 Microcontroller; Up To 32 Kb Flash And 8 Kb Sram
• Manufacturer: NXP Semiconductors

NXP Semiconductors
4. Ordering information
Table 1.
LPC1110_11_12_13_14
Product data sheet
Type number
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20
LPC1111FDH20/002
LPC1112FD20/102
LPC1112FDH20/102
LPC1112FDH28/102
LPC1114FDH28/102
LPC1114FN28/102
HVQFN33 and LQFP48 packages
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1112FHI33/202
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/301
LPC1113FHN33/302
LPC1114FHN33/201
LPC1114FHN33/202
Ordering information
Package
Name
SO20
TSSOP20
SO20
TSSOP20
TSSOP28
TSSOP28
DIP28
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
All information provided in this document is subject to legal disclaimers.
Description
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
DIP28: plastic dual in-line package; 28 leads (600 mil)
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
Rev. 6 — 2 November 2011
LPC1110/11/12/13/14
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2011. All rights reserved.
Version
SOT163-1
SOT360-1
SOT163-1
SOT360-1
SOT361-1
SOT361-1
SOT117-1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
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