lpc1114fn28/102 NXP Semiconductors, lpc1114fn28/102 Datasheet - Page 76

• Manufacturer Part Number: lpc1114fn28/102
• Description: 32-bit Arm Cortex-m0 Microcontroller; Up To 32 Kb Flash And 8 Kb Sram
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC1110_11_12_13_14
Product data sheet
Fig 48. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 6 — 2 November 2011
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
LPC1110/11/12/13/14
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2011. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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