lpc2939fbd208 NXP Semiconductors, lpc2939fbd208 Datasheet - Page 92
lpc2939fbd208
Manufacturer Part Number
lpc2939fbd208
Description
Arm9 Microcontroller With Can, Lin, And Usb
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2939FBD208.pdf
(98 pages)
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LPC2939_1
Preliminary data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Fig 41. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 01 — 11 June 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
ARM9 microcontroller with CAN, LIN, and USB
temperature
peak
LPC2939
© NXP B.V. 2009. All rights reserved.
001aac844
time
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