mb95f204h Fujitsu Microelectronics, Inc., mb95f204h Datasheet - Page 60

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mb95f204h

Manufacturer Part Number
mb95f204h
Description
F2mc-8fx Mb95200h/210h Series
Manufacturer
Fujitsu Microelectronics, Inc.
Datasheet

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MB95200H/210H Series
■ PACKAGE DIMENSIONS
Please check the latest package dimensions at the following URL.
http://edevice.fujitsu.com/package/en-search/
C
3.00
4.80(.189)MAX
2008 FUJITSU MICROELECTRONICS LIMITED D24066S-c-1-1
24-pin plastic DIP
+0.20
– 0.30
(DIP-24P-M07)
.118
1.778(.070)
+.008
– .012
24
INDEX
1
2
(DIP-24P-M07)
4
p -
n i
p
a l
s
c i t
#22.86 ± 0.10(.900 ± .004)
D
P I
(.039 ±. 004)
1.00 ± 0.10
BTM E-MARK
0.43
.017
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
+0.09
– 0.04
+.004
– .002
13
12
Mounting height
Sealing method
Package width ×
package length
L
e
a
0.50(.020)
d
(.252 ± .004)
MIN
6.40 ± 0.10
p
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
c t i
0.25
.010
h
+0.10
– 0.04
+.004
– .002
6.40 mm × 22.86 mm
7.62(.300)
TYP.
4.80 mm Max
Plastic mold
1
7 .
7
8
m
m
(Continued)

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