sc16c852sviet NXP Semiconductors, sc16c852sviet Datasheet - Page 43

• Manufacturer Part Number: sc16c852sviet
• Description: 1.8 V Dual Uart, 20 Mbit/s Max. With 128-byte Fifos, Infrared Irda , And Xscale Vlio Bus Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
11. Package outline
Fig 16. Package outline SOT912-1 (TFBGA36)
SC16C852SV_1
Product data sheet
TFBGA36: plastic thin fine-pitch ball grid array package; 36 balls; body 3.5 x 3.5 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT912-1
VERSION
OUTLINE
max
1.15
A
0.25
0.15
A
ball A1
index area
ball A1
index area
1
0.90
0.75
A
2
D
C
B
A
F
E
IEC
- - -
0.35
0.25
b
1
e
1/2 e
2
3.6
3.4
D
3
e
D
1
4
3.6
3.4
JEDEC
E
- - -
Dual UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
b
5
0
REFERENCES
0.5
6
e
Rev. 01 — 23 September 2008
1/2 e
2.5
e
1
e
B A
w
v
e
E
M
M
JEITA
2
2.5
e
- - -
2
C
C
scale
2.5
A
0.15
v
B
0.05
w
A
0.08
y
A
5 mm
2
A
0.1
y
1
1
y
1
C
PROJECTION
detail X
EUROPEAN
SC16C852SV
X
C
y
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
05-08-09
05-09-01
SOT912-1
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