spear-09-h122 STMicroelectronics, spear-09-h122 Datasheet - Page 35

• Manufacturer Part Number: spear-09-h122
• Description: Spear Tm Head600
• Manufacturer: STMicroelectronics

SPEAR-09-H122
6
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 7.
DIM.
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A2
A3
A4
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PBGA420 Mechanical Data & Package Dimensions
MIN.
22.80
22.80
0.27
0.45
1.305
0.785
21.00
21.00
23.00
23.00
TYP.
mm
0.52
0.50
1.00
1.00
MAX.
23.20 0.8976 0.9055 0.9134
23.20 0.8976 0.9055 0.9134
1.81
0.55 0.0177 0.0197 0.0217
0.20
0.25
0.10
0.0106
MIN.
0.0514
0.0205
0.0309
0.8268
0.8268
0.0394
0.0394
inch
TYP.
0.0713
0.0079
0.0098
0.0039
MAX.
PBGA420 (23x23x1.81mm)
Ball Grid Array Package
MECHANICAL DATA
OUTLINE AND
Package information
7859856 A
®
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