m24lr16e-r STMicroelectronics, m24lr16e-r Datasheet - Page 135

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m24lr16e-r

Manufacturer Part Number
m24lr16e-r
Description
16 Kbit Eeprom With Password Protection, Dual Interface & Energy Harvesting 400 Khz I²c Bus & Iso 15693 Rf Protocol At 13.56 Mhz
Manufacturer
STMicroelectronics
Datasheet

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M24LR16E
Figure 88. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (E2 × D2 area in the above illustration) is internally pulled to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 128. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MC)
E2 (rev MC)
Symbol
be connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
eee
A1
L1
L3
A
D
E
K
b
e
L
(2)
2 × 3mm, package outline
2 x 3 mm, data
0.550
0.020
0.250
2.000
3.000
0.500
Typ
millimeters
Doc ID 018932 Rev 7
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.300
0.300
0.300
0.080
Min
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
Max
0.0217
0.0008
0.0098
0.0787
0.1181
0.0197
Typ
Package mechanical data
SS
. It must not be allowed to
inches
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
0.0118
0.0118
0.0118
0.0031
Min
(1)
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
0.0197
0.0059
Max
135/143

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