oq2541bhp NXP Semiconductors, oq2541bhp Datasheet - Page 13

• Manufacturer Part Number: oq2541bhp
• Description: Oq2541bhp; Oq2541bu Sdh/sonet Data And Clock Recovery Unit Stm1/4/16 Oc3/12/48 Ge
• Manufacturer: NXP Semiconductors

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING INSTRUCTIONS
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single sided
2000 Sep 18
V
V
I
P
T
T
T
R
R
SYMBOL
SYMBOL
n
amb
j
stg
EE
n
tot
th(j-s)
th(j-a)
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
57
57
negative supply voltage
DC voltage on pins
input current on pins
total power dissipation
ambient temperature
junction temperature
storage temperature
thermal resistance from junction to solder point
thermal resistance from junction to ambient
1.6 mm FR4 epoxy PCB with 35 m thick copper tracks. The measurements are performed in still air.
CLOOP, CLOOPQ, DLOOP, DLOOPQ, CREF, CREFQ, DIN, DINQ,
DOUT, DOUTQ, COUT and COUTQ
ENL, ALLON, BYPASS, LOCK and LOS
DREF19, DOUT1250, DOUT622, DOUT155, PC and AREF
CAPUPQ and CAPDOQ
ENL, ALLON and BYPASS
CREF, CREFQ, DIN and DINQ
PARAMETER
PARAMETER
13
in free air; note 1
CONDITIONS
OQ2541BHP; OQ2541BU
V
V
V
6
1
20
10
10
65
EE
EE
EE
MIN.
VALUE
+ 0.5
EE
0.5 +5.5
0.5 +0.5
46
67
and GND pads first, the
+0.5
+0.5
1
+10
700
+85
+110
+150
Product specification
0.5
MAX.
UNIT
K/W
K/W
V
V
V
V
V
mA
mA
mW
C
C
C
UNIT