am49pdl127ah Meet Spansion Inc., am49pdl127ah Datasheet - Page 8

• Manufacturer Part Number: am49pdl127ah
• Description: Stacked Multi-chip Package Mcp Flash Memory And Psram, 128 Megabit 8m ? 16-bit Cmos 3.0 Volt-only, Simultaneous Operation Flash Memory And 16 Mbit 1m ? 16-bit Cmos Pseudo Static Ram
• Manufacturer: Meet Spansion Inc.

Flash AC Characteristics . . . . . . . . . . . . . . . . . . . 60
6
Read-Only Operations – Am29PDL127H ............................... 60
Read-Only Operations – Am29PDL129H ............................... 60
Hardware Reset (RESET#) .................................................... 62
Erase and Program Operations .............................................. 63
Temporary Sector Unprotect .................................................. 68
Alternate CE#f1 Controlled Erase and Program Operations .. 70
Between Pseudo SRAM and Flash................................................. 59
Figure 13. Read Operation Timings ................................................ 61
Figure 14. Page Read Operation Timings....................................... 61
Figure 15. Reset Timings ................................................................ 62
Figure 16. Program Operation Timings........................................... 64
Figure 17. Accelerated Program Timing Diagram........................... 64
Figure 18. Chip/Sector Erase Operation Timings ........................... 65
Figure 19. Back-to-back Read/Write Cycle Timings ....................... 66
Figure 20. Data# Polling Timings (During Embedded Algorithms).. 66
Figure 21. Toggle Bit Timings (During Embedded Algorithms)....... 67
Figure 22. DQ2 vs. DQ6.................................................................. 67
Figure 23. Temporary Sector Unprotect Timing Diagram ............... 68
Figure 24. Sector/Sector Block Protect and
Unprotect Timing Diagram .............................................................. 69
A D V A N C E
Am49PDL127AH/Am49PDL129AH
I N F O R M A T I O N
Pseudo SRAM AC Characteristics . . . . . . . . . . . 72
Erase And Programming Performance . . . . . . . 77
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 77
Package Pin Capacitance. . . . . . . . . . . . . . . . . . . 77
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 77
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 78
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 79
Power Up Time ....................................................................... 72
Read Cycle ............................................................................. 72
Write Cycle ............................................................................. 74
TLA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ............. 78
Figure 25. Flash Alternate CE#f1 Controlled Write (Erase/Program)
Operation Timings.......................................................................... 71
Figure 26. Pseudo SRAM Read Cycle—Address Controlled......... 72
Figure 27. Pseudo SRAM Read Cycle........................................... 73
Figure 28. Pseudo SRAM Write Cycle—WE# Control ................... 74
Figure 29. Pseudo SRAM Write Cycle—CE1#s Control ................ 75
Figure 30. Pseudo SRAM Write Cycle—
UB#s and LB#s Control.................................................................. 76
December 18, 2003