mt18hts25672chy-667 Micron Semiconductor Products, mt18hts25672chy-667 Datasheet

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mt18hts25672chy-667

Manufacturer Part Number
mt18hts25672chy-667
Description
2gb, 4gb X72, Dr 200-pin Ddr2 Sdram Socdimm
Manufacturer
Micron Semiconductor Products
Datasheet
DDR2 SDRAM SOCDIMM
MT18HTS25672CH – 2GB
MT18HTS51272CH – 4GB
For component data sheets, refer to Micron’s Web site:
Features
• 200-pin, small outline clocked dual in-line memory
• Fast data transfer rates: PC2-4200 or PC2-5300
• 2GB (256 Meg x 72), 4GB (512 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• DLL to align DQ and DQS transitions with CK
• Multiple internal device banks for concurrent
• Programmable CAS# latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BLs): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Phase-lock loop (PLL) to reduce system clock line
• Gold edge contacts
• Dual rank
• I
Table 1:
PDF: 09005aef8253e3ea/Source: 09005aef8253e404
HTS18C256_512x72CH.fm - Rev. B 6/07 EN
module (SOCDIMM)
operation
loading
2
Speed
Grade
DD
DDSPD
C temperature sensor
-667
-53E
= V
DD
= +3.0V to +3.6V
Q = +1.8V
Key Timing Parameters
Industry Nomenclature
Products and specifications discussed herein are subject to change by Micron without notice.
PC2-5300
PC2-4200
t
CK
CL = 5
667
Data Rate (MT/s)
2GB, 4GB (x72, DR) 200-Pin DDR2 SDRAM SOCDIMM
www.micron.com
CL = 4
533
533
1
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Frequency/CAS latency
• PCB height
PCB height 30.0mm (1.18in)
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin DIMM (Pb-free)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 30.0mm (1.18in)
CL = 3
400
400
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. CL = CAS (READ) latency.
module offerings.
200-Pin SOCDIMM (MO-224 R/C B)
t
(ns)
RCD
15
15
A
A
1
2
≤ +85°C)
≤ +70°C)
©2006 Micron Technology, Inc. All rights reserved.
(ns)
t
15
15
RP
Marking
Features
None
-53E
-667
(ns)
t
Y
I
55
55
RC

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mt18hts25672chy-667 Summary of contents

Page 1

... Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 200-Pin SOCDIMM (MO-224 R/C B) Marking 1 ≤ +70°C) A ≤ +85° module offerings RCD RP (ns) (ns ©2006 Micron Technology, Inc. All rights reserved. Features None I ...

Page 2

... Column address Module rank address Table 3: Part Numbers and Timing Parameters – 2GB Modules Base device: MT47H256M8THN, Module 2 Part Number Density 2GB MT18HTS25672CHY-667__ MT18HTS25672CHY-53E__ 2GB Table 4: Part Numbers and Timing Parameters – 4GB Modules Base device: MT47H512M8THM, Module 2 Part Number Density ...

Page 3

... DQS2 97 A9 147 149 SS Notes: 1. Pin for 2GB and A14 for 4GB modules. PDF: 09005aef8253e3ea/Source: 09005aef8253e404 HTS18C256_512x72CH.fm - Rev. B 6/07 EN 2GB, 4GB (x72, DR) 200-Pin DDR2 SDRAM SOCDIMM Pin Symbol Pin Symbol Pin Symbol Pin Symbol V 151 ...

Page 4

... LOAD MODE command. Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect and temperature sensor portion of the module. Temperature sensor alarm output. Power supply: +1.8V ±0.1V. ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0# DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DM DQ8 DQ DQ9 DQ DQ10 DQ ...

Page 6

... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes are programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in the device data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli- ability ...

Page 8

Table 9: DDR2 I Specifications and Conditions – 2GB DD Values shown are for MT47H256M8THN DDR2 TwinDie SDRAM components from device I 2Gb TwinDie (256 Meg x 8) component data sheet Parameter/Condition Operating one bank active-precharge current RAS ...

Page 9

Table 10: DDR2 I Specifications and Conditions – 4GB DD Values shown are for MT47H512M8THM DDR2 TwinDie SDRAM components from device I 4Gb TwinDie (512 Meg x 8) component data sheet Parameter/Condition Operating one bank active-precharge current RAS ...

Page 10

PLL Specifications Table 11: PLL Specifications CUA845 device or JESD82-21 equivalent Parameter Symbol V DC high-level input IH voltage V DC low-level input IL voltage Input voltage (limits Input differential-pair V IX cross voltage V ( Input differential ...

Page 11

... Temperature Sensor The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I the JEDEC standard JESD21-C, page 4.7-1. Table 13: Temperature Sensor Specifications All voltages referenced to V Parameter/Condition Supply voltage Average operating supply current Input high voltage: Logic 1; All inputs Input low voltage: Logic 0 ...

Page 12

... SMBus Slave Subaddress Decoding The temperature sensor’s physical address differs from the module’s SPD device physical addresses: 0011 for A0, A1, A2, and RW# in binary where A2, A1, and A0 are the three slave subaddress pins and the RW# pin is the READ/WRITE flag. ...

Page 13

Table 15: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...

Page 14

Table 19: Capability Register Bits 0–15 Descriptions (continued) Bit Description 1 Accuracy 0: ±2°C over the active range and ±3°C over the monitor range 1: ±1°C over the active range and ±2°C over the monitor range 2 Wider range 0: ...

Page 15

Table 21: Configuration Register Bits 0–10 Descriptions (continued) Bit Description 7 Critical trip lock bit 0: Critical trip is not locked and can be changed 1: Critical trip is locked and cannot be changed 8 Shutdown mode 0: Enabled 1: ...

Page 16

Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit (LSB) is equal to 0.0625°C or 0.25°C depending on which register is referenced example, ...

Page 17

Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The LSB for this register is 0.0625°C with a resolu- tion of 0.0625°C. The most significant bit (MSB) is 128°C in ...

Page 18

Serial Presence-Detect Table 28: Serial Presence-Detect EEPROM and Temperature Sensor DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage with temperature sensor option Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output ...

Page 19

... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on assembly 4 Number of column addresses on assembly 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see byte 18) ...

Page 20

... Optional features, not supported 62 SPD revision 63 Checksum for bytes 0–62 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 Identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99– ...

Page 21

... TYP Back view U9 U10 U11 U12 4.2 (0.165) Pin 200 TYP 47.4 (1.87) 11.4 (0.45) TYP 16.26 (0.64) ® property of their respective owners. 21 Module Dimensions 3.80 (0.150) MAX U8 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP 1.10 (0.043) 0.90 (0.035) TYP Pin 199 U13 10.00 (0.394) TYP Pin 2 TYP TYP Micron Technology, Inc., reserves the right to change products or specifications without notice. ...

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