tga8652-epu-sl TriQuint Semiconductor, tga8652-epu-sl Datasheet - Page 3

• Manufacturer Part Number: tga8652-epu-sl
• Description: Oc192 Modulator Driver, Smt Package
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas: [phone] Fax [phone] Email: [e-mail] Web: www.triquint.com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
(channel to backside of package)
NOTE: Thermal transfer is conducted thru the bottom of the TGA8652-EPU package into the
motherboard. Design the motherboard to assure adequate thermal transfer to the base plate. An array
of filled thermal vias is recommended as shown in the example below.
* This information is a result of a thermal model.
Thermal vias
in motherboard
R
θ JC
Thermal Resistance
Parameter
Motherboard
Vd(RF out) = 6.5 V, Vctrl = 1 V,
Id = 170 mA ± 5%,
T
THERMAL INFORMATION*
base
= 80 °C
Test Condition
Bottom View TGA8652-EPU
Product Data Sheet
114.70
(°C)
T
CH
June 14, 2005
(°C/W)
31.40
Area of thermal
transfer
R
θJC
2.6E+7
(HRS)
MTTF
3