A1280DX-1CQB ACTEL [Actel Corporation], A1280DX-1CQB Datasheet - Page 14

• Manufacturer Part Number: A1280DX-1CQB
• Description: Integrator Series FPGAs: 1200XL and 3200DX Families
• Manufacturer: ACTEL [Actel Corporation]

P ac k a g e Th e r m a l C h a ra c t er i s ti c s
The device junction to case thermal characteristic is θ
and the junction to ambient air characteristic is θ
thermal characteristics for θ
air flow rates.
P ow e r D i s s i p a t i on
G e n e r a l P ow e r E qu a t i o n
where:
An accurate determination of N and M is problematic
because their values depend on the family type, design
details, and on the system I/O. The power can be divided
into two components: static and active.
S t a t ic P ow e r C om p o ne nt
Actel FPGAs have small static power components that
result in lower power dissipation than PALs or PLDs. By
integrating multiple PALs/PLDs into one FPGA, an even
greater reduction in board-level power dissipation can
be achieved.
14
Package Type
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Leaded Chip Carrier
Thin Quad Flat Pack
Power Quad Flat Pack
Power Quad Flat Pack
Very Thin Quad Flat Pack
I
outputs are changing.
I
I
V
N equals the number of outputs driving TTL loads to V
M equals the number of outputs driving TTL loads to V
CC
CC
OL
OL
P = [I
standby is the current flowing when no inputs or
active is the current flowing due to CMOS switching.
, I
, V
OH
OH
are TTL sink/source currents.
CC
are TTL level output voltages.
standby + I
+ I
OH
Max. junction temp. (°C) – Max. commercial temp.
---------------------------------------------------------------------------------------------------------------------------- -
* (V
CC
active] * V
CC
ja
– V
are shown with two different
OH
) * M
CC
Pin Count
+ I
θ
100
144
160
208
176
208
240
100
84
ja
OL
(°C/W)
* V
OL
* N
Discontinued – v3.0
ja
I n t e g r a to r S e r i e s F P G A s : 1 2 0 0 X L a n d 3 2 0 0 D X F a m i l i e s
. The
OL
OH
16.8°C/W
16.1°C/W
jc
Still Air
42°C/W
36°C/W
34°C/W
25°C/W
37°C/W
32°C/W
43°C/W
.
.
,
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a PQFP 160-pin package with still air
at commercial temperature is as follows:
The power dissipation due to standby current is typically a
small component of the overall power. Standby power is
calculated below for commercial worst case conditions.
The static power dissipation by TTL loads depends on the
number of outputs driving HIGH or LOW and the DC load
current. Again, this number is typically small. For instance,
a 32-bit bus sinking 4 mA at 0.33V will generate 42 mW with
all outputs driving LOW and 140 mW with all outputs driving
HIGH. The actual dissipation will average somewhere in
between as I/Os switch states with time.
A c t i v e P ow e r C om p o n e n t
Power dissipation in CMOS devices is usually dominated by
the active (dynamic) power dissipation. This component is
frequency-dependent, a function of the logic and the
external I/O. Active power dissipation results from charging
internal
unprogrammed antifuses, module inputs, and module
outputs, plus external capacitance due to PC board traces
and load device inputs. An additional component of the
active power dissipation is the totem pole current in the
CMOS transistor pairs. The net effect can be associated with
an equivalent capacitance that can be combined with
frequency and voltage to represent active power dissipation.
θ
ja
=
I
2 mA
CC
150°C – 70°C
---------------------------------
300 ft/min
chip
16.2°C/W
10.6°C/W
11.4°C/W
34°C/W
33°C/W
29°C/W
27°C/W
28°C/W
25°C/W
35°C/W
capacitances
V
5.25 V
=
CC
2.4W
Still Air
Maximum Power Dissipation
1.9 W
2.2 W
2.4 W
3.2 W
2.2 W
2.5 W
4.8 W
5.0 W
1.9 W
of
Power
10.5 mW
the
interconnect,
300 ft/min
2.4 W
2.8 W
3.0 W
4.9 W
2.9 W
3.2 W
7.0 W
7.5 W
2.3 W