PCF2123BS NXP [NXP Semiconductors], PCF2123BS Datasheet - Page 46

• Manufacturer Part Number: PCF2123BS
• Description: SPI Real time clock/calendar
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
15. Bare die outline
Fig 31. Bare die outline of PCF2123U/10
PCF2123_1
Product data sheet
Wire bond die; 12 bonding pads; 1.492 x 1.449 x 0.20 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Dimension includes saw lane
2. P
3. P
mm
PCF2123U/10
2
1
UNIT
OUTLINE
VERSION
and P
and P
nom
4
3
: passivation opening
: pad size
0.20
A
1.492
D
10
11
12
(1)
7
8
9
Table 46.
[1]
[2]
Symbol
SDO
SDI
SCL
CLKOE
CLKOUT
V
OSCI
OSCO
TEST
INT
CE
V
Alignment mark
IEC
DD
SS
1.449
E
[2]
x
All coordinates are referenced in m to the center of the die (see
The substrate (rear side of the die) is wired to V
(1)
0
0
y
e
1.296
D
D
e
D
Bonding pad locations
P
0.09
1
JEDEC
(2)
6
5
4
3
2
1
X
0.081
E
P
REFERENCES
2
(3)
Rev. 01 — 19 November 2008
Pad
1
2
3
4
5
6
7
8
9
10
11
12
P
0.09
3
(2)
0.081
P
JEITA
4
(3)
A
0
scale
SS
but should not be electrically connected.
Coordinates
x
648.0
648.0
648.0
648.0
648.0
648.0
693
1 mm
648.0
648.0
648.0
648.0
648.0
648.0
Figure
[1]
P
P
PROJECTION
EUROPEAN
detail X
2
1
SPI Real time clock/calendar
31).
P
4
P
3
y
171.2
369.2
625.7
639.0
421.9
575.0
377.0
179.0
25.9
223.9
441.0
639.0
516.2
PCF2123
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
08-07-16
08-07-24
PCF2123U/10
46 of 54