PCF2123BS NXP [NXP Semiconductors], PCF2123BS Datasheet - Page 5

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PCF2123BS

Manufacturer Part Number
PCF2123BS
Description
SPI Real time clock/calendar
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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Quantity
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Table 3.
[1]
[2]
8. Device protection diagram
PCF2123_1
Product data sheet
Symbol
OSCI
OSCO
n.c.
TEST
INT
CE
V
SDO
SDI
SCL
CLKOE
CLKOUT
V
SS
DD
The die paddle (exposed pad) is wired to V
The substrate (rear side of the die) is wired to V
Pin description
Pin
TSSOP14
1
2
3, 11
4
5
6
7
8
9
10
12
13
14
7.2 Pin description
Fig 5.
HVQFN16
16
1
6, 7, 14, 15
2
3
4
5
8
9
10
11
12
13
[1]
Device diode protection diagram of PCF2123
SS
but should not be electrically connected.
SS
PCF2123U/10
7
8
-
9
10
11
12
1
2
3
4
5
6
Rev. 01 — 19 November 2008
but should not be electrically connected.
[2]
OSCO
TEST
OSCI
V
INT
CE
SS
Description
oscillator input; high-impedance node; minimize wire length
between quartz and package
oscillator output; high-impedance node; minimize wire
length between quartz and package
do not connect and do not use as feed through; connect to
V
test pin; not user accessible; connect to V
floating (internally pulled down)
interrupt output (open-drain; active LOW)
chip enable input (active HIGH) with internal pull down
ground
serial data output, push-pull; high-impedance when not
driving; can be connected to SDI for single wire data line
serial data input; may float when CE is inactive
serial clock input; may float when CE is inactive
CLKOUT enable or disable pin; enable is active HIGH
clock output (open-drain)
supply voltage; positive or negative steps in V
oscillator performance; recommend 10 nF decoupling
close to device (see
DD
if floating pins are not allowed
PCF2123
V
CLKOE
CLKOUT
SCL
SDI
SDO
001aai552
DD
Figure
SPI Real time clock/calendar
28)
PCF2123
© NXP B.V. 2008. All rights reserved.
SS
or leave
DD
may affect
5 of 54

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