TDA9898HL/V3 NXP [NXP Semiconductors], TDA9898HL/V3 Datasheet - Page 100
TDA9898HL/V3
Manufacturer Part Number
TDA9898HL/V3
Description
Multistandard hybrid IF processing
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.TDA9898HLV3.pdf
(103 pages)
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NXP Semiconductors
18. Abbreviations
TDA9897_TDA9898_4
Product data sheet
17.4 Package related soldering information
Table 60.
[1]
[2]
Table 61.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
ADC
AFC
AGC
ATV
BP
CW
DAC
DC
DIF
DSP
DTV
DVB
DVB-C
DVB-T
EMI
ESD
FPLL
I/O
IC
IF
LCD
LIF
MAD
NB
NICAM
PLL
POR
QSS
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Analog-to-Digital Converter
Automatic Frequency Control
Automatic Gain Control
Analog TV
Band-Pass
Continuous Wave
Digital-to-Analog Converter
Direct Current
Digital Intermediate Frequency
Digital Signal Processor
Digital TV
Digital Video Broadcasting
Digital Video Broadcasting-Cable
Digital Video Broadcasting-Terrestrial
Electro-Magnetic Interference
ElectroStatic Discharge
Frequency Phase-Locked Loop
Input/Output
Integrated Circuit
Intermediate Frequency
Liquid Crystal Display
Low Intermediate Frequency
Module Address
NarrowBand
Near Instantaneous Companded Audio Multiplex
Phase-Locked Loop
Power-On Reset
Quasi Split Sound
Rev. 04 — 25 May 2009
Soldering method
Dipping
-
suitable
-
TDA9897; TDA9898
Multistandard hybrid IF processing
Wave
suitable
suitable
not suitable
© NXP B.V. 2009. All rights reserved.
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