MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 61

• Manufacturer Part Number: MPC8347
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

18.3
Freescale Semiconductor
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
620 Plastic ball grid array (PBGA).
Package outline
Interconnects
Pitch
Module height (maximum)
Module height (typical)
Module height (minimum)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8347EA PBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
620
1.00 mm
2.46 mm
2.23 mm
2.00 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.60 mm
29 mm × 29 mm
Package and Pin Listings
61