MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 97

• Manufacturer Part Number: MPC8347
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Interface material vendors include the following:
20.3
When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.
The spring clip should connect to the printed circuit board, either to the board itself, to hooks soldered to
the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the
package from the board. Such peeling forces reduce the solder joint lifetime of the package. The
recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive
attachment should attach to painted or plastic surfaces, and its performance should be verified under the
application requirements.
Freescale Semiconductor
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 994
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Heat Sink Attachment
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
408-436-8770
800-522-2800
603-635-5102
781-935-4850
800-248-2481
888-642-7674
800-347-4572
Thermal
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