MPC8533E_10 FREESCALE [Freescale Semiconductor, Inc], MPC8533E_10 Datasheet - Page 76

• Manufacturer Part Number: MPC8533E_10
• Description: Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Package Description
18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
76
Package Parameters for the MPC8533E FC-PBGA
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Table 56. Package Parameters
Parameter
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Freescale Semiconductor
Table
56.