MPC8533E_10 FREESCALE [Freescale Semiconductor, Inc], MPC8533E_10 Datasheet - Page 93

• Manufacturer Part Number: MPC8533E_10
• Description: Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer
for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under
the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case,
the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in
the package library file will suffice for these simulations. The user will need to determine the optimal grid
for their specific case.
Freescale Semiconductor
Conductivity
Kx
Ky
Kz
Section A-A
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Top View
Figure 56. System Level Thermal Model for MPC8533E (Not to Scale)
Bump Underfill
A
Table 67. MPC8533EThermal Model (continued)
Solder and Air (29 × 29 × 0.58 mm)
Value
0.034
0.034
12.1
Solder/Air
Substrate
Die
W/m•K
Units
A
Thermal
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