MPC8533E_10 FREESCALE [Freescale Semiconductor, Inc], MPC8533E_10 Datasheet - Page 95

no-image

MPC8533E_10

Manufacturer Part Number
MPC8533E_10
Description
Integrated Processor Hardware Specifications
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, Chip
Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal
resistances, that will allow the MPC8533E to function in various environments.
20.3.1
For the packaging technology, shown in
are as follows:
Freescale Semiconductor
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Internal Package Conduction Resistance
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Table
65, the intrinsic internal conduction thermal resistance paths
Thermal
95

Related parts for MPC8533E_10