MPC860DP FREESCALE [Freescale Semiconductor, Inc], MPC860DP Datasheet - Page 7

• Manufacturer Part Number: MPC860DP
• Description: Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

5 Power Dissipation
Table 5
where CPU frequency is twice the bus speed.
Freescale Semiconductor
1
2
3
4
5
6
Mold Compound Thickness
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
1
2
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
on the top surface of the board near the package.
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
temperature per JEDEC JESD51-2.
D.4
(1:1 mode)
D.4
(2:1 mode)
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
Thermal characterization parameter indicating the temperature difference between the package top and the junction
Typical power dissipation is measured at 3.3 V.
Maximum power dissipation is measured at 3.5 V.
provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1,
Rating
Values in
power dissipation over V
due to buffer current, depending on external circuitry.
5
4
1
Die Revision
6
Table 5
Natural convection
Airflow (200 ft/min)
Natural convection
represent V
MPC860 Family Hardware Specifications, Rev. 7
Table 4. MPC860 Thermal Resistance Data
Table 5. Power Dissipation (P
DDH
Environment
DDL
. I/O power dissipation varies widely by application
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
-based power dissipation and do not include I/O
NOTE
Frequency (MHz)
50
66
66
80
D
)
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
θJA
Typical
θJC
θJB
JT
TBD
656
722
851
2
3
3
3
MPC860P
1
0.85
ZP
34
22
27
18
14
6
2
Maximum
TBD
735
762
909
MPC860P
ZQ / VR
Power Dissipation
1.15
34
22
27
18
13
2
8
2
Unit
mW
mW
mW
mW
°C/W
Unit
mm
7