PALCE26V12 AMD [Advanced Micro Devices], PALCE26V12 Datasheet - Page 20

• Manufacturer Part Number: PALCE26V12
• Description: 28-Pin EE CMOS Versatile PAL Device
• Manufacturer: AMD [Advanced Micro Devices]

TYPICAL THERMAL CHARACTERISTICS
Measured at 25 C ambient. These parameters are not tested.
PALCE26V12
Plastic jc Considerations
The data listed for plastic jc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the jc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of
the package. Furthermore, jc tests on packages are performed in a constant-temperature bath, keeping the package surface at
a constant temperature. Therefore, the measurements can only be used in a similar environment.
Parameter
Symbol
jma
ja
jc
Parameter Description
Thermal impedance, junction to case
Thermal impedance, junction to ambient
Thermal impedance, junction to ambient with air flow
PALCE26V12H-15/20
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
SKINNYDIP
19
65
59
54
50
50
Typ
PLCC
18
55
48
44
39
37
AMD
Unit
C/W
C/W
C/W
C/W
C/W
C/W
2–325