SAK-XC2264-56F66L INFINEON [Infineon Technologies AG], SAK-XC2264-56F66L Datasheet - Page 99

• Manufacturer Part Number: SAK-XC2264-56F66L
• Description: 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance
• Manufacturer: INFINEON [Infineon Technologies AG]

Preliminary
5.2
When operating the XC226x in a system, the total heat generated on the chip must be
dissipated to the ambient environment to prevent overheating and resulting thermal
damages.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
The power dissipation must be limited so the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and the switching frequencies.
If the total power dissipation determined for a given system configuration exceeds the
defined limit countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(see
OH
+
) ×
P
Table
IODYN
I
OH
) + Σ(
) ×
14).
R
ΘJA
V
OL
×
I
OL
97
)
R
ΘJA
” is a measure for these parameters.
XC2000 Family Derivatives
Package and Reliability
XC2267 / XC2264
P
IODYN
V0.1, 2007-02
Draft Version
) depends