PIC24FJ32GB002-E/ML MICROCHIP [Microchip Technology], PIC24FJ32GB002-E/ML Datasheet - Page 307

• Manufacturer Part Number: PIC24FJ32GB002-E/ML
• Description: 28/44-Pin, 16-Bit, Flash Microcontrollers with USB On-The-Go (OTG) and nanoWatt XLP Technology
• Manufacturer: MICROCHIP [Microchip Technology]

TABLE 29-1:
TABLE 29-2:
 2010 Microchip Technology Inc.
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
=  ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
DD
– V
Characteristic
OH
–  I
} x I
Rating
OH
OH
)
) +  (V
OL
x I
OL
PIC24FJ64GB004 FAMILY
)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX




P
T
T
JA
JA
JA
JA
A
D
J
33.7
39.3
Min
Typ
-40
-40
49
28
(T
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39940D-page 307
+140
+125
°C/W
°C/W
°C/W
°C/W
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W