AT17LV002 ATMEL Corporation, AT17LV002 Datasheet - Page 14

• Manufacturer Part Number: AT17LV002
• Description: FPGA Configuration EEPROM Memory
• Manufacturer: ATMEL Corporation

Thermal Resistance Coefficients
Notes:
14
Package Type
8CN4
8P3
8S1
20J
20S2
44A
44J
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
Leadless Array Package (LAP)
Plastic Dual Inline Package (PDIP)
Plastic Gull Wing Small Outline
(SOIC)
Plastic Leaded Chip Carrier
(PLCC)
Plastic Gull Wing Small Outline
(SOIC)
Thin Plastic Quad Flat Package
(TQFP)
Plastic Leaded Chip Carrier
(PLCC)
AT17LV65/128/256/512/010/002/040
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JA
JA
JA
JA
JA
JA
JA
JC
JC
JC
JC
JC
JC
JC
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
[ ° C/W]
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(1)
AT17LV128/
AT17LV256
AT17LV65/
115.71
107
150
45
37
45
35
90
–
–
–
–
AT17LV512/
AT17LV010
135.71
107
45
37
35
90
–
–
–
–
–
–
AT17LV002
159.60
45
35
90
17
62
15
50
–
–
–
–
2321E–CNFG–06/03
AT17LV040
17
62
15
50
–
–
–
–
–
–
–
–
–
–