MCF5232 ETC, MCF5232 Datasheet - Page 27

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MCF5232

Manufacturer Part Number
MCF5232
Description
Integrated Microprocessor Hardware Specification
Manufacturer
ETC
Datasheet

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5.2
Figure 3
Freescale Semiconductor
196X
13X
3
e
X
E
Y
b
0.30
0.10 Z
shows MCF5232CVMxxx package dimensions.
S
Package Dimensions—196 MAPBGA
0.20
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 3. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
MCF523x Integrated Microprocessor Hardware Specification, Rev. 1.3
10
9
View M-m
D
6
13X
S
5
e
4
3
2
1
Preliminary
M
A
B
C
D
E
F
G
H
K
L
N
P
J
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Mechanicals/Pinouts and Part Numbers
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM
A1 0.27 0.47
A2 1.18 REF
Detail K
A 1.32 1.75
D 15.00 BSC
b 0.35 0.65
E 15.00 BSC
e
S
4
°
Min Max
Millimeters
1.00 BSC
0.50 BSC
0.15 Z
5
0.30 Z
27

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