BS62LV4006ECG70 BSI [Brilliance Semiconductor], BS62LV4006ECG70 Datasheet - Page 11

• Manufacturer Part Number: BS62LV4006ECG70
• Description: Very Low Power CMOS SRAM 512K X 8 bit
• Manufacturer: BSI [Brilliance Semiconductor]

R0201-BS62LV4006
PACKAGE DIMENSIONS (continued)
ZD
RAD R
32
1
L
L2
TSOP II - 32
DETAIL "X"
-T-
RAD R1
Y Y
Y
D
SEATING PLANE
e
GAGE PLANE
b
WITH PLATING
16
17
SECTION Y-Y
b1
b
BASE METAL
11
"X"
NOTE:
1. CONTROLLING DIMENSION : MILLIMETERS.
2. REFREENCE DOCUMENT : JEDEC MS-024
3. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION.
4. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION.
MOLD PROTRUSION SHALL NOT EXCEED 0.15(0.006") PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION.
INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25(0.01") PER SIDE.
ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO
BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm
DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER
THAN THE MIN b DIMENSION BY MORE THAN 0.07mm.
E
E1
e
L
L1
L2
R
R1
ZD
Y
A
A1
A2
b
b1
c
c1
D
0.95
0.30
0.30
0.12
0.10
11.56
10.03
0.05
20.82
0.40
0.12
0.12
MIN.
DIMENSION
0.95 REF
1.27 BASIC
0.25 BASIC
0.8 REF
(MM)
1.00
0.127
11.76
10.16
0.10
20.95
0.50
0.40
NOM.
0.15
21.08
1.20
1.05
0.52
0.45
0.21
0.16
11.96
10.29
0.60
0.25
0.10
MAX.
BS62LV4006
0.005
0.002
0.037
0.012
0.012
0.005
0.004
0.820
0.455
0.394
0.016
0.005
MIN.
DIMENSION
0.037 REF
0.050 BASIC
0.010 BASIC
0.031 REF
(INCH)
0.004
0.039
0.016
0.825
0.463
0.400
0.005
0.020
NOM.
Revision
Oct.
0.047
0.006
0.042
0.020
0.018
0.008
0.006
0.830
0.471
0.405
0.024
0.010
0.004
MAX.
2008
1.5